$ASMPT (00522.HK)$ The stock rose more than 7% during early trading. As of the time of writing, it had gained 5.01%, trading at HKD 123.6, with a turnover of HKD 262 million.
In terms of news, Samsung Electronics is advancing the diversification of its supply chain for thermal compression (TC) bonding equipment, a key component of high bandwidth memory (HBM). It has been reported that the company recently completed demonstration testing of HBM thermal compression bonding machines with ASMPT and decided to move forward to the next stage of cooperation. According to industry insiders on April 13, Samsung Electronics plans to initiate a Joint Evaluation Project (JEP) with ASMPT for HBM thermal compression bonding machines.
Caitong Securities noted that ASMPT aims to consolidate its leading position in the industry by targeting a 35%-40% market share in thermal compression bonding (TCB). In the HBM field, the company has secured orders from multiple customers for applications in HBM4-12Hi, achieving an industry-first breakthrough, while steadily advancing the development of HBM4-16Hi technology. Additionally, the company has completed the sale of its AAMI business and plans to sell its NEXX business, focusing on backend packaging. It has also initiated a strategic review of its SMT business, which may lead to a potential sale, joint venture, spin-off, or public listing in the future.
Editor/Rocky