The electronic information industry has received favorable policy support.
Hong Kong-listed chip-related sectors rose collectively today; semiconductor stocks gained in early trading, with Tianshu Zhixin surging over 10%, Biren Technology rising more than 7%, Hua Hong Hongli up nearly 3%, and SMIC increasing by over 1%.
Hong Kong-listed PCB concept stocks moved higher in early trading, with Xinqi Micro Assembly rising nearly 8%, Han's CNC up over 6%, Guanghe Technology, Shenghong Technology, and Kingboard Group gaining more than 5%, and Kingboard Laminates rising over 4%.
Hong Kong-listed memory stocks advanced, with GigaDevice rising over 8% and Montage Technology up more than 7%.
Optical communication concept stocks rebounded, with Haiguang Xinzheng rising nearly 5%, Zhongji Innolight up over 3%, Lightelligence gaining nearly 3%, and Cambridge Technologies rising more than 2%.
On September 15, according to Xinhua News Agency, the Ministry of Industry and Information Technology and the National Development and Reform Commission issued the "15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry" (hereinafter referred to as the "Plan"). The Plan states that by 2030, China's electronic information manufacturing industry is expected to play a pivotal role in the global industrial landscape, with operating revenue of enterprises above designated size exceeding RMB 30 trillion. A batch of leading-edge technologies and products will emerge in fields such as integrated circuits, advanced computing, consumer electronics, basic electronics, and energy electronics, fostering world-class enterprises with strong competitiveness.
The intensity of industrial R&D investment will reach 3.5%. New progress will be made in the coordination of industrial hardware, software, standards, and patents, and new achievements will be realized in regional layout and international cooperation. The level of intelligent, green, and integrated development will improve, providing strong support for safeguarding national economic and social development security and enhancing people's material and cultural living standards.
Promote breakthroughs across the entire integrated circuit value chain
Regarding strengthening industrial foundational capabilities, the Plan proposes promoting breakthroughs across the entire integrated circuit value chain. It aims to develop high-end chip products such as high-performance processors, high-density memory, and high-reliability analog and mixed-signal chips. It seeks to enhance integrated circuit manufacturing capabilities, refine mature process technologies, and improve advanced process capabilities. The Plan also promotes the development and application of advanced packaging and testing technologies, drives quality improvement and upgrading in the wide-bandgap semiconductor industry, and advances the industrialization of ultra-wide-bandgap semiconductors such as gallium oxide and diamond. Furthermore, it aims to continuously enhance the supply capacity of key equipment, materials, and components, accelerate the development of electronic design automation (EDA) tools and intellectual property (IP) cores, and promote technological breakthroughs and applications in areas such as 3D integration.
The Plan clarifies the promotion of high-end development for electronic components and electronic materials. It advocates for the coordinated development of the electronic components and electronic materials industries, targeting demands in key areas such as artificial intelligence, next-generation information communications, aerospace, and new-generation smart terminals. The Plan aims to accelerate the development of a batch of mature, reliable, and widely applicable industrial foundation "off-the-shelf products." It supports the development of circuit, connection, electromechanical, sensor, and functional material electronic components toward high frequency, high speed, high integration, and high reliability. Additionally, it seeks to achieve breakthroughs in high-performance electronic functional materials, packaging and assembly materials, and process and auxiliary materials, thereby improving the stability, reliability, and consistency of electronic components and electronic materials to better meet the development needs of complete machines and systems.
The Plan mentions accelerating the innovation and application of smart sensors. It aims to enhance process capabilities for smart sensors such as micro-electromechanical systems (MEMS) and support the development of sensor reliability technologies. The Plan seeks to establish a comprehensive quality control mechanism covering the entire process of smart sensor design, manufacturing, and packaging/testing, thereby accelerating improvements in product stability and consistency. It aims to push a batch of mainstream smart sensor products toward the high-end segment, enhance systematic supply capabilities and system-level application capabilities, strengthen the market competitiveness of high-end products, and promote the integrated application of smart sensors in key industries and scenarios.
The Plan requires strengthening the foundation of the photonics industry. It aims to achieve breakthroughs in core technologies, support the R&D and iteration of simulation design software such as photonic design automation and optoelectronic co-design automation, and build common process platforms for micro-nano fabrication and optoelectronic integration. It also involves deploying R&D and innovation in photonic functional materials and process materials, enhancing the supply of light generation, processing, sensing, integrated photonic chips, and micro-nano optical components, and promoting the R&D and industrialization of optical transceiver modules and engines, optical processing modules, LiDAR, gyroscopes, and supporting electronic chip devices. Pilot verification platforms will be established around key areas and common needs of the photonics industry to facilitate outcome validation, process optimization, equipment selection, and technology integration, thereby accelerating new product R&D and industrial application.
Accelerate the deep integration of AI agents with terminal products
Regarding the cultivation of new growth drivers for industrial development, the Plan proposes to solidify the hardware foundation for artificial intelligence. It supports technological breakthroughs and product iteration upgrades. The Plan emphasizes synergy between AI chips and complete machine products, accelerates the development of cloud-based training equipment, develops edge-side inference devices and chips for fields such as embodied AI and autonomous driving, and consolidates and expands the scale of AI chip applications. It also promotes the formulation and implementation of a series of standards for the Computing High-Speed Interconnect Bus (CLink) unified protocol.
The Plan also mentions strengthening the adaptation of AI chips with large models and databases. It calls for building relevant public service platforms and improving the AI chip standard system. It continues to promote the iteration and upgrade of products such as AI smartphones, personal computers, smart glasses, audio-visual terminals, in-vehicle terminals, industrial terminals, and commercial terminals, broadening usage scenarios and optimizing user experience. The Plan emphasizes tackling key technologies at the edge side and promoting the application and transformation of innovative achievements. It strengthens compatibility and adaptation among edge-side large models, computing chips, memory chips, and operating systems, accelerating the deep integration of AI agents with terminal products. It establishes a graded standard and evaluation system for AI terminal intelligence and strengthens the promotion of standard implementation. Additionally, it accelerates the construction of an upstream and downstream ecosystem in the industrial chain, supporting the large-scale application of AI terminals in key sectors.
In terms of enhancing the competitiveness of complete electronic machines and systems, the Plan proposes constructing an advanced computing ecosystem. It aims to accelerate technological breakthroughs in advanced computing products such as computing architecture, data storage, high-speed interconnects, hardware-software synergy, and computing-power synergy. The Plan promotes the establishment of major national science and technology projects for advanced computing, continuously improving the supply level of foundational computing technologies, key components, core parts, software algorithms, and computing equipment. To meet the demands of massive and diversified intelligent computing, it seeks to build a heterogeneous collaborative computing system, develop computing micro-architectures oriented toward AI large model training and inference, and break through key technologies such as distributed computing, high-bandwidth memory pools, cloud-edge-end collaboration, all-optical switching, and liquid cooling.
Strengthen the synergy and integrated innovation of factors such as computing power, storage capacity, network transmission capacity, and electricity. Accelerate the deployment of new computing paradigms such as processing-in-memory, quantum computing, optical computing, neuromorphic computing, and space computing, and promote the integrated development of intelligent computing, general-purpose computing, and supercomputing. Improve the computing standard system, strengthen the construction of service platforms, promote the wide application of advanced computing in next-generation intelligent manufacturing, information consumption, social governance, and other fields, and perfect the collaborative innovation ecosystem for advanced computing.
The Plan requires advancing hardware-software synergy and achieving breakthroughs in electronic system equipment. It aims to build a secure, reliable, advanced, and ubiquitous next-generation information technology system, prioritize hardware capabilities, and comprehensively enhance the system performance of electronic information products. The Plan emphasizes open-source openness and collaborative co-construction, strengthens the adoption of domestic operating systems such as OpenHarmony, creates a full-stack AI hardware and software ecosystem based on computing, and improves supporting tools for hardware-software collaborative adaptation.
The Plan also mentions promoting the R&D and industrialization of the fifth-generation Reduced Instruction Set Computer (RISC-V) architecture, supporting the application of RISC-V chips in fields such as artificial intelligence and embedded systems. It deepens collaborative innovation between chips and modules, and strengthens the collaborative design and optimization of algorithms and hardware architectures. The Plan aims to consolidate competitive advantages in communication equipment, accelerate technological and product breakthroughs in high-end data communication, optical communication, mobile communication, satellite communication, and next-generation wireless short-range communication. It also promotes the intelligent upgrading of industrial control equipment and constructs an integrated industrial computing system combining computing, control, sensing, and transmission.